CIPDB › China Industry › Industrial Equipment & Components › Industrial Ceramic Products
China, Chinese Customized Alumina Ceramic Substrates, Copper Cu 0.1um 0.2um Silver AG 0.3um~1im Ni 2~10um Different Thickness Metal Materials1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Products Details Supplier Manufacturer price list catalog
Industrial Ceramic ProductsCopper Cu 0.1um 0.2um Silver AG 0.3um~1im Ni 2~10um Different Thickness Metal MaterialsCeramic SubstrateAmb Substrate
Shenyang Vhandy Technology Co., Ltd
Preview:
Product DescriptionProduct DescriptionThick-film Substrates on Ceramic SurfacesCeramic surface metallization is a process that creates a uniform metal coating on a ceramic substrate. Its primary purpose is to enhance the ceramic material's properties, including electrical conductivity, mechanical strength, and corrosion resistance. Thick-film metallization technology involves depositing conductive and functional layers onto the ceramic surface, creating components that combine the inherent properties of ceramic with the enhanced functionality of metallization.Thick-film substrates are primarily used in low-cost, low- to medium-power applications, such as consumer electronics, sensors, and resistor networks.Applied Area- Automotive: ABS, Power Steering, DC/DC Converter, LED Lighting, Ignition Control Power Electronics: IGBT, MOSFET, Thyristor Module, Solid-state Relay, Diode, Power transistors - Home Appliance: Air Conditioner, Peltier Cooler - Industrial: LED Displays, Welding Machine- Aerospace: Laser, Power Supply for Satellites and Aircrafts - Environmental Technology: Local Power Generation, Electric Vehicle, Traction Control System, Photovoltaic Units, Wind Power- PC/IT: Power Supply, UPS SystemMechanical PropertiesMaterialAIO(96 99 ZTA)AINSiNDimensions50*50mm50*50mm50*50mmCustomizableThickness0.635mm1.0mm0.32mmCustomizableDensity≥3.7g/cm3≥3.3g/cm3≥3.2±0.25 g/cm3Surface RoughnessRa≤1.5um; Rz≤10umGrindableWarp≤200umWetability≥ 95%Flexural Strength≥330MPa≥350MPa700~800MPaElectrical CharacteristicsThermal conductivity23W/m.k230W/m.k85W/m-kCoefficient of thermal expansion6.6~7.5(25~ 500℃)10-6/ K4.7(20 ~ 300°℃)10-6/K2.5(20~ 300℃)10-6/KDielectric loss0.0003MHz0.0005MHz0.001MHzDielectric constant9MHz9MHz8MHzDielectric strength≥20KV/mm≥20KV/mm≥20KV/mmResistivity1014Ω.cm1014Ω.cm1014Ω.cmViasHole diameter120~160umHole spacing≥0.2mmPositioning accuracy±150umHole to metal edge distance≥0mmHole to tile edge distance≥1mmCuttingFull cut/Can cut rounded cornersPre-cut depth30 ~ 80%Accuracy±50umConductivity98.3MS/mProduct PerformanceHot and cold cycle (-40°C/air to 170°C/air)≥1000 times (no delamination)Void rate (ultrasonic scanning)≤0.01% (200um resolution)Paste PrintingMain ingredientsCu Ag TiThickness10~50umEffective printing area99%Surface TreatmentPlating (Ni Ag Au)Ni layer thickness2~10umAg layer thickness0.03~ 1.0umAu added layer thickness0.01~ 0.2umSolder MaskInk colorGreen, blackThickness10umOur FactoryPacking & DeliveryFAQQ: Are you trading company or manufacturer?A: We are manufacturer.Q: How long is your delivery time?A: Generally within 30 working days, it is according to quantity.Q: Do you provide samples? Is it free or extra?A: The samples can be provided, but the shipping cost should be on buyer's account.Q: What is your term of payment?A: Payment<=10000 USD, 100% in advance. Payment>=10000 USD, 70% T/T in advance, balance before shipment.
Purchasing Agent
Note: Send your message to supplier or manufacturer.
Welcome to our Professional and comprehensive procurement services...