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Aluminum Oxide Aluminum Nitride Ceramic Surface Thick Film Substrate Amb Au AG Ti Metallized Ceramic Sheet Direct Bond Copper Active Metal Brazing1
Industrial Ceramic ProductsCeramic SubstrateAmb Substrate
Shenyang Vhandy Technology Co., Ltd
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Product DescriptionProduct DescriptionThick-film Substrates on Ceramic SurfacesCeramic surface metallization is a process that creates a uniform metal coating on a ceramic substrate. Its primary purpose is to enhance the ceramic material's properties, including electrical conductivity, mechanical strength, and corrosion resistance. Thick-film metallization technology involves depositing conductive and functional layers onto the ceramic surface, creating components that combine the inherent properties of ceramic with the enhanced functionality of metallization.Thick-film substrates are primarily used in low-cost, low- to medium-power applications, such as consumer electronics, sensors, and resistor networks.Applied Area- Automotive: ABS, Power Steering, DC/DC Converter, LED Lighting, Ignition Control Power Electronics: IGBT, MOSFET, Thyristor Module, Solid-state Relay, Diode, Power transistors - Home Appliance: Air Conditioner, Peltier Cooler - Industrial: LED Displays, Welding Machine- Aerospace: Laser, Power Supply for Satellites and Aircrafts - Environmental Technology: Local Power Generation, Electric Vehicle, Traction Control System, Photovoltaic Units, Wind Power- PC/IT: Power Supply, UPS SystemMechanical PropertiesMaterialAIO(96 99 ZTA)AINSiNDimensions50*50mm50*50mm50*50mmCustomizableThickness0.635mm1.0mm0.32mmCustomizableDensity≥3.7g/cm3≥3.3g/cm3≥3.2±0.25 g/cm3Surface RoughnessRa≤1.5um; Rz≤10umGrindableWarp≤200umWetability≥ 95%Flexural Strength≥330MPa≥350MPa700~800MPaElectrical CharacteristicsThermal conductivity23W/m.k230W/m.k85W/m-kCoefficient of thermal expansion6.6~7.5(25~ 500℃)10-6/ K4.7(20 ~ 300°℃)10-6/K2.5(20~ 300℃)10-6/KDielectric loss0.0003MHz0.0005MHz0.001MHzDielectric constant9MHz9MHz8MHzDielectric strength≥20KV/mm≥20KV/mm≥20KV/mmResistivity1014Ω.cm1014Ω.cm1014Ω.cmViasHole diameter120~160umHole spacing≥0.2mmPositioning accuracy±150umHole to metal edge distance≥0mmHole to tile edge distance≥1mmCuttingFull cut/Can cut rounded cornersPre-cut depth30 ~ 80%Accuracy±50umConductivity98.3MS/mProduct PerformanceHot and cold cycle (-40°C/air to 170°C/air)≥1000 times (no delamination)Void rate (ultrasonic scanning)≤0.01% (200um resolution)Paste PrintingMain ingredientsCu Ag TiThickness10~50umEffective printing area99%Surface TreatmentPlating (Ni Ag Au)Ni layer thickness2~10umAg layer thickness0.03~ 1.0umAu added layer thickness0.01~ 0.2umSolder MaskInk colorGreen, blackThickness10umOur FactoryPacking & DeliveryFAQQ: Are you trading company or manufacturer?A: We are manufacturer.Q: How long is your delivery time?A: Generally within 30 working days, it is according to quantity.Q: Do you provide samples? Is it free or extra?A: The samples can be provided, but the shipping cost should be on buyer's account.Q: What is your term of payment?A: Payment<=10000 USD, 100% in advance. Payment>=10000 USD, 70% T/T in advance, balance before shipment.
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