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ESD Moisture Barrier Bag for Wafer PCB Packing1
Packaging MaterialsMoisture Barrier BagESD Bag
Suzhou Winwinet New Materials Co., Ltd.
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Product Description ESD Moisture Barrier Bag is widely used in vacuum packing of static sensitive electronic components, precise equipment, chemical raw material and medical intermediate etc.Application:ESD Moisture Barrier Bag is mainly applied to pack PCB, wafer, IC, large precise mechanical equipment, chemical raw material, medical intermediate, food and so on.Features:1. It is made of 3 or 4-layer laminated film. This film is featured of good moisture barrier and UV-light isolation property. 2. Different bag types are available as zip-lock bag, flat open bag, gusset bag, 3D large bag and round-bottom bag etc. 3. Film thickness and structure can be customized with enough MOQ.Service and quality control 1. We can support customers to print their logo or product introduction etc. with customers' authorization certificate.2. Various thickness and special material structure can be customized.3. The third-party testing reports are available such as ROHS and Halogen etc.Material Structure:Specification Material CompositionPET/AL/NY/PEInner Surface ResistanceANSI ESD-STM-11.11 ≤ 1011 ohmOuter Surface ResistanceANSI ESD-STM-11.11≤ 1011 ohmDecay TimeIEC61340-5-1(±1000V~±100V)< 2sFriction Voltage < 100V WVTR ASTM F1249-2013< 0.0003g/100in2/24hsOTR ASTM D3985-2017< 0.01cc/100in2/24hs Factory Show:Product Picture:
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