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Manual Wafer Dicing Equipment / Wafer Cleaving Machine / Wafer Cleaver / Wafer Dicing Breaking1
Assembly Line Production Line, Electronic Production Line, Wafer Scriber, Wafer Cleaving
Guangzhou Minder-Hightech co.,Ltd
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Product Description Manual Wafer Scriber1.Equipment for scribing and splitting semiconductor substrates such as GaAs and Inp. 2.Can be used for R&D and mass production.Features1. The maximum wafer size that can be scratched is 8 inches.2. The scratch width is ≤ 10μm.3. The resolution is 1μm.Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. FAQ1. About Price:All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.2. About Sample:We can provide sample production services for you, but you may provide some fees.3. About Payment:After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.4. About Delivery:After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.5. Installation and Debugging:After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.6. About Warranty:Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
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