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Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning Machines1
Machine Tools, Grinding Machine, Grinding Machine, High Precise Grinding Machine
Shenzhen Ponda Grinding Technology Co.,Ltd.
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Product Description Why Ponda?Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.Equipment structureThe equipment is mainly composed of frame, air spindle, porous ceramic suction cup (suitable for various types of ring), vacuum spindle deceleration motor, static pressure air suspension electric spindle, diamond grinding wheel, screw guide module, full closed-loop servo control system, cutting fluid circulation system, etc.Products ShowEquipment features1. The vacuum spindle is made of 603 stainless steel material, which is not easily affected by thermal expansion and leads to the precision of grinding size, and the bearing is made of well-known brands.2. Vacuum suction cups are divided into microporous ceramic suction cups and special stainless steel gas slots, which can be selected according to product requirements.3. The vacuum spindle is driven by precision reducer and servo motor.4. The rotor of the static pressure gas suspension spindle adopts zirconia ceramic, which completely avoids the heat transmitted by the motor causing the gas film gap to be too large after the expansion of the floating rotor and reduces the rigidity of the spindle. The equipment using the spindle has high precision and good stability.5. Screw guide module adopts high precision and high preloading type.6. Full closed-loop grating control system: to ensure the servo motor to the precision of the grinding wheel feed monitoring and repair.7. Grinding fluid circulation system: The grinding fluid in the production process continues to cool the workpiece, grinding wheel and electric spindle through the circulation system, and the grinding fluid can also improve the self-sharpness of the grinding wheel.APPLICATIONSinglePlateLapping& PolishingMetal And AlloyCeramicOxideCarbideGlassPlasticNature StoneSealingvalve and sealing ring(liquid, oil, gas)SemiconductorLED substrate(Al2O3, Si, SiC)wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN)PlasticPE, E/VAC, SBS, SBR, NBR, SR, BR, PRPhone Frame(flat)back platePCBadhesive, coating, circuitOptics(flat)optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glassRadaroxide coating plateGemstonejade, sapphire, agate, etc.Othersgraphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware.*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed.SPECIFICATION Technical parameterThe size of the vacuum sucker is 300mmMaximum processing size 300mmWork plate speed (continuously adjustable) 0-300rpm/minWheel size 300mm(12 inches)Grinding wheel spindle power7.5kwProduct processing thickness error ≤±0.003mm(medium 100mm)Product processing flatness≤0.003mm(medium 100mm)Feed repeated positioning accuracy0.001mmRoughness Ras0.2Vacuum negative pressure 20-90KpaGrinding modeWafer rotation, axial in-Feed grindingMode of operationSemi-automatic grinding method (manual loading and unloading)Equipment dimensions1200*1100*2100mmWeight 2350KGBuilt-In Optional KitsGradeStandardUpgradedAdvancedControlsDigitalDigitalTouch-Screen PLCPressure SourceHand Weight BlockPneumatic Weight BlockManualPneumatic PressIntegrated with PLCSlurry Supply System-ManualDigital, ManualCylinder Bar Drive System-ManualIntegrated with PLCConditioning Ring Drive System-ManualIntegrated with PLCMachine Enclosure-Framed by Aluminum AlloyFramed by Metal Plate*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.SAMPLE DEMONSTRATION (SINGLE PLATE)About the CompanyFactory front deskPonda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materialsProduction and assembly shopWe have a production workshop and testing equipment, assembly workers and mechanical design engineers45 peoplePatentDelivery & PackingPacking Details : Packing, 1 pcs/carton. FAQsQ1: Which machine is most applicable for my product?A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:1. If better flatness and roughness were required, you might need both lapping and polishing machine.2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.3. If the productivity were excessive, you might need larger machine or to expand production line.Additionally, we can confirm the production line as we make samples for you.Q2: Does Ponda charge for making samples?A: No, it's free to make samples.Q3: Is Ponda trader or manufacturer?A: We are manufacturer, certified National High-Tech Enterprise.Q4: How long does it take machine to deliver?A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.Q5: Does Ponda provide oversea setup and after-sale service?A: Yes, we provide oversea service and online tutorial.Q6: How many type of machine does Ponda manufacture?A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.
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