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Circuit Board Laser Cutting Machine Applied for Depaneling PCB/FPC/FPCB1
Laser Equipment, Cutting Machine, Laser Cutting Machine
Shenzhen Superwave Laser Technology Co., Ltd.
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Product Description Circuit Board Laser Depaneling Machine Applied For Cutting PCB/FPC/FPCB | Supuerwave ? PCB laser depaneling machine is an advanced tool used to separate individual circuit boards from larger panels with high precision and minimal mechanical stress. The machine utilizes laser technology, which provides several advantages over traditional mechanical cutting methods like routing, punching, or V-scoring. The following are the key applications of a PCB laser depaneling machine: Product DescriptionFeatures1. High quality cutting edge of PCB & FPC: The narrow beam diameter of the laser enables precise and high quality processing of the PCB & FPC material.2. Sress-free processing: Due to the non-contact process, Laser separates the printed circuit boards from the panel without any mechanical stress to the material. 3. Keep clean processing: In mechanical processes, such as milling, dust is generated during the manufacturing process, while Laser depaneling evaporates the material, and at the same time, Fume extraction device exhausts the cutting fumes and keep the boards clean. 4. Materials diversity: Superwave Laser Depaneling can process a wide variery of different substrate materials with ease by varying the process parameters. Product ParametersTechnical Data Laser modelSW-PCBLaser power10W / 15W / 20WWorking Area200 x 300mm (Customization Accepted)Laser wavelength355±15nmMax diameter of Focus beam20μmRepeatability<=2μmLaser pulse frequency40 kHz to 300kHzFile format.Gerber/. dxf /.plt /.jpg, etcFiber cable core diameter<=2KWCooling systemWater chillerPower supplyAC220V/50-60HzOptions Air compressor / Fume ExhaustionProduct Cases
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