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Wafer, Optical Lens, and Filter Thinning Machine1
Stone Processing Machinery, Optical Lens, and Filter Thinning Machine, Thinning Machine, Polishing
Shanghai Anttrans Technology Co., Ltd
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Product Description Product Description1. Applications:This machine is primarily used for double-sided precision grinding and polishing of metal and non-metal hard and brittle materials, including optical glass, crystals, quartz wafers, sapphire glass, lithium ni obate, gallium arsenide, ceramics, ferrite sheets, silicon wafers, valve plates, valve discs, friction plates, rigid sealing rings, cylinder piston rings, and oil pump vanes.2. Equipment Principle:This grinding and polishing machine is a double-sided precision device. The workpiece to be ground or polished is placed on the lower grinding plate. The upper and lower grinding plates rotate relative to each other or in the same direction. The workpiece is rotated or revolved by a central gear carrier, and pressure is applied to the upper grinding plate via a cylinder. The relative motion between the workpiece and the grinding plates results in uniform friction, achieving the grinding and polishing of the workpiece.3. Equipment Features:The functions of rapid lifting, rapid lowering, slow lifting, and slow lowering of the upper plate are integrated into a single handle, making operation more convenient.A unique safety locking mechanism prevents accidental "plate dropping" injuries in case of sudden air or power outages.An automatic floating positioning device for the upper plate reduces the hassle of plate misalignment and alignment.A semi-automatic lifting system for the gear ring and water retaining ring facilitates workpiece placement and removal, as well as gear engagement, while also meeting the requirements for changing the engagement height of the satellite gears.The upper plate, lower plate, and central wheel are driven by independent motors, allowing for optimal speed ratios between the upper plate, lower plate, central wheel, and satellite gears. The satellite gears can rotate in both forward and reverse directions to meet the needs of the disk repair process.The large gear ring rotates with the lower plate, ensuring smooth operation of the satellite wheels.The large gear ring and central gear are lifted and lowered simultaneously.Product Parameters Technical Specifications:SpecificationDetailsGrinding plate size (upper/lower plate) (mm)640*235*35Satellite wheel parametersZ=108/m=DP12Number of satellite wheels5Maximum processing diameter (mm)202Grinding plate speed (r.p.m)3-45Air pressure (MPa)0.5-0.6Total power (KW)8.5Gross weight (KG)2330Overall dimensions (WDH) (mm)1660*1230*2360Detailed Photos
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