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PVD Triple-Target RF Magnetron Sputtering Coating Machine for Jewelry Vacuum Plating1
Metallic Processing Machinery, Coating Machine, Powder Coating
HENAN RUNJING INSTRUMENT EQUIPMENT CO.,LTD
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Product Description (Three Targets: 2×500W DC, 1×500W RF)Three-Target Magnetron Sputtering Coating SystemSample StageSizeΦ100-200mmTemperature Accuracy±1°CHeating TemperatureUp to 500°CRotation Speed1-30 rpm adjustableMagnetron Sputtering HeadsQuantity2" ×3 (1", 2" optional)Chiller Specifications10L/min flow rateCooling MethodWater-cooled Vacuum ChamberChamber Sizeφ320mm × 380mmViewportφ100mmChamber MaterialStainless SteelOpening MethodTop-liftingMass Flow Controller2 channels; Range: 100sccm (customizable for multi-channel gas paths as needed)Vacuum SystemModelCY-GZK103-APumping PortKF40Molecular PumpFJ-150Exhaust PortKF16Backing PumpGHD-031BVacuum MeasurementCompound Vacuum GaugeUltimate Vacuum10E-5PaPower SupplyAC 220V, 50/60HzPumping SpeedMolecular Pump: 150L/s; Rotary Pump: 4L/s; Overall Performance: 20 min to reach 10E-3PaPower ConfigurationQuantityDC Power Supply, RF Power SupplyMax Output PowerDC: 500W; RF: 300WOther SpecificationsOperating VoltageAC 220V, 50HzDimensions1100mm × 650mm × 1280mmTotal Power3.5 kWWeight300 kgUltimate Vacuum Level10E-5Pa Triple-Target Magnetron Sputtering Coating SystemThe triple-target magnetron sputtering coating system is a cost-effective, self-developed thin-film deposition device featuring standardization, modularity, and customization.Key Features:Target Options: 1-inch or 2-inch magnetron targets, allowing customers to choose based on substrate size.Power Supply:500W DC power supply for depositing metal films.300W RF power supply for depositing non-metal films.Three targets enable multi-layer or repeated coating.Customizable power options (DC, RF, pulsed) available in 300W-1000W configurations.Gas Control System:Standard: Two high-precision mass flow controllers (MFCs).Upgradable: Up to four MFCs for complex gas environments.Vacuum System:Standard turbo molecular pump with an ultimate vacuum of 10^(-5) Pa.Optional alternative pump models available.Electrically controlled valves allow sample exchange without shutting down the pump, significantly improving efficiency.Control System:Optional integrated industrial PC for automated control, including:Vacuum pump managementSputtering power adjustmentAnd other advanced functions to enhance experimental efficiency.Applications:This system is ideal for depositing single or multi-layer films, including:Ferroelectric filmsConductive filmsAlloy filmsSemiconductor filmsCeramic filmsDielectric filmsOptical filmsOxide filmsHard coatingsPTFE (Teflon) filmsAdvantages Over Competing Systems:Wide applicability across diverse materials.Compact design for easy operation.An ideal solution for laboratory-scale thin-film preparation.This triple-target magnetron sputtering system combines performance, flexibility, and user-friendly operation, making it a top choice for advanced material research and development.
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