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Damping Cloth Polishing Pad Is Used for Glass Polishing and Silicon Wafer Polishing1
Stone Processing Machinery, Polishing Pad, Damping Cloth Polishing Pad
Shanghai Anttrans Technology Co., Ltd
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Product Description Product Description Polyurethane Polishing PadProduct IntroductionThe polyurethane polishing pad is a relatively durable abrasive cloth. Various abrasive cloths suitable for different needs can be made according to hardness, density, types of abrasive grains, and distribution of abrasive grain sizes. It is widely used in the polishing of integrated circuits, Si/SiC substrates, glass, optical lenses, and other substrates.product catalogModelThickness(mm)Density(g/cm3)Compressbility(%)Elastolty (%)Hardnessi(Shore A/D)ApplicationBLP9000*1.0-2.50.780-0.8400.5-4.0NA56.5-65.0DFor Cu,W,STI,ILD CMPPUN-881.00.45-0.551.0-3.075-9585-95AFor Sic lapping,Si stock polishingPUN-50D10-3.50.65-0.751.0-3.070-9045-55DFor SiC stock and final palishingPUM-60D1.0-3.50.75-0.850.5-2.570-9055-65DFor SiC stock polishing,wafer polishingPUM-50D1.0-3.50.68-0.781.0-3.070-9050-60DFor SiC stock polishing,wafer polhingPUP-801.0-3.50.40-0.501.0-3.070-9075-85AFor glass,precision optics,LCD,glass disk polishingPUP-951.0-3.50.45-0.551.0-3.065-8585-95AFor sapphire substrate and window piece polishingPUP-40D1.0-3.50.45-0.551.0-3.065-8535-45DFor sapphire substrae and window piece polishingNon-woven Polishing PadProduct IntroductionThe non-woven polishing pad is a composite material obtained by impregnating non-woven fabric with resin. It is commonly used for coarse or medium polishing of silicon wafers, silicon carbide, sapphire, optical lenses, metals, and other materials.ModelThickness(mm)Density(g/cm3)Compressibility(%)Elasticity (%)Hardness(Shore A/D)ApplicationNWS-601.2-1.40.22-0.328-1470-9055-65The substrate of composite pad,for silicon intermediate polishingNWS-701.2-1.40.31-0.413-760-8070-80For GaAs,InP stock polishing,Si edge polishingNWD-801.2-1.40.35-0.452-560-8075-85For Sisubstrate stock polishing andintermediate polishingNWS-851.2-1.40.45-0.551-455-7580-90For SiC substrate double-side polishing NWD-901.3-1.40.4-0.51-455-7582-92For sapphire and Si substrate stock polishingproduct catalogDamping Cloth Polishing PadProduct IntroductionIt is a porous elastomeric material prepared from resin, foaming additives, pigments (optional), etc. It is used for precision grinding processes requiring high smoothness and low defect ivity. The most suitable products can be produced by matching different types of substrates according to customer needs. It is mainly used for the precision polishing of semiconductor substrates, hard disks, LCD glass substrates, sapphire, glass, and other materials.product catalogModelThickness(mm)Density(g/cm3)Compressibility(%)Elasticity (%)Hardness(Shore A)NAPthickness(μm)Pore Size(μm)ApplicationDPP-790.72-1.020.65-0.8512-2283-9772A-86A290-49020~60Edge casting pad for 8"silicon waferDPN-590.9-1.20.28-0.489-1983-9754A-60A500-70030~70For cover glass polishingDPN-50W1.35-1.650.27-0.4711-2183-9743A-57A450-65030~70For SiC substrate final polishingDPN-501.35-1.650.28-0.488-1883-9743A-57A450-65020~60For Si substrate final polishingDPN-50L1.30-1.600.25-0.4521-3183-9738A-52A450-65030~70For blue glass stock polishingDPN-451.35-1.650.25-0.4526-3683-9736A-50A480-68080~120For quartz substrate final polishingDetailed Photos
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