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Silicon Carbide Etching Wafer Surface Clean Residue Removal Rie Plasma Glue Remover1
Etching Machine, Rie, Plasma
Guangzhou Minder-Hightech co.,Ltd
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Product Description Product DescriptionICP PLASMA Glue remover ASKINGPolymer removalDry removal of hard mask layerPhotoresistance removal after ion implantationPhotoresistance removal in BAW/SAW processDry cleaning of anti reflective graphic film layerSurface residue removalSurface cleaning after etchingDESCUMProduct Parameters PLASMA sourceRFRFpower ICP1000w1000wBIAS 600w(option)600w(option)Applicable scope4~8 inch4~8 inchSingle processing slice count12Appearance dimensions1080x1840x1800mm1340x2050x1800mmSystem controlIndustrial control systemIndustrial control systemAutomation levelautomaticautomaticDetailed Photos We have 16 years of experience in equipment sales ,and can provide you with a one-stop IC Package Line Equipment solution!
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