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Picosecond Glass Laser Cutting Machine Precision Cutting for Flawless Results1
Glass Machine, Laser Glass Cutting, Glass Cutting
SHENZHEN HS TECHNOLOGY CO., LTD
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Product Description Product Overview 80w High Productive Infrared Picosecond and RF CO2 Laser Source Glass Precision Cutting Machine Bezier Cutting Head* Linear motor ten double platform - high precision, high speed, stable* Cutting head cutting - fast speed and good cutting effect* CCD system - accurate positioning, lower clamping requirements* Humanized design - easy to operate* Modular design - easy to expand functions Product Description Machine size: 2400(L)*2500(W)*2000(H)(mm) 1. The worker puts the product on the No. 1 platform for positioning, and the No. 1 platform moves to the cutting position;2. The CCD positions the product, then cuts and processes it, and moves to the rear for splitting after cutting;3. After processing, the product is manually taken out to complete the product processing process;4. The movement principle of No. 2 platform is the same as that of No. 1 platform.1. Marble platform: stable bearing, corrosion resistance2. Linear motor model X/Y axis linear motor, optical ruler, double station platform. The linear motor and the optical ruler are closed-loop controlled by the motion controller. The speed is fast and the positioning accuracy is high. When moving, the stator and the mover have no contact, and there is no long-term wear tear.uIndicators:1. Flatness of marble platform: ±0.01mm2. Platform specifications: double station platform3. X/Y platform stroke: estimated 1800x1600mmu Moving speed: ≤1000mm/su Acceleration: ≥10000mm/ssu Positioning accuracy: ≤ ±5umu Repeat positioning accuracy: ≤ ±5um SpecificationHigh Precision Motion SystemItemParameterX/Y-Max Cutting Area600mm *700mmMotorLinear motor ( Netherlands Tecnotion /Taiwan HIWN )maximum acceleration1gRepeat accuracy±5μm per axis @ 20°C ± 1Kpositioning accuracy±5μm per axis @ 20°C ± 1KLaser and Cooling SystemItemParameterLaser Type80W picosecond laserPlace of OrginalChinaMax Average Power(W)80WPulse Width≤12psWavelength(nm)1064nmSpot Diameter1-3mmMax Repetition Rate50MHzSingle Pulse Energy1.5mjBeam qualityM2 < 1.3Cooling methodwaterCutting Head TypeBezier cutting headwavelength1030-1070nmCutting thickness20mmDamage Threshold12j/cm,100Hz,6nsBrandHS LASERCutting Sample
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