IPDB › China Industry › Manufacturing & Processing Machinery › Glass Machine
30W 50W 60W 75W 80W Fine Laser Glass Processing Machine1
Glass Machine, Picosecond Laser Glass Cutting Machine, Cutting Glass
SHENZHEN HS TECHNOLOGY CO., LTD
Preview:
Product Description HS LASER float glass laser cutting macahine with 600x700mm double working table Picosecond Laser Glass Cutting Machine: Applications, Compatible Glass Types, and Cutting Parameters 1. Core Application Industries1.1 Consumer ElectronicsTarget Materials:Smartphone/tablet cover glass (e.g., Corning Gorilla Glass, AGC Dragontrail).Curved glass for wearables (e.g., smartwatches, AR/VR lenses).Key Requirements:Ultra-thin glass cutting (0.3-1.1 mm) with anti-cracking technology.High-precision shaped cuts (e.g., camera holes, fingerprint modules) with ±5 μm accuracy.Case Study:A global smartphone manufacturer uses a 20W picosecond laser to cut 0.7 mm microcrystalline glass, achieving edge chipping <10 μm.1.2 Automotive & Autonomous DrivingTarget Materials:Curved glass for automotive triple-screen displays (1.5-3 mm thickness).Quartz optical windows for LiDAR systems.HUD projection glass with anti-glare coatings.Technical Edge:3D dynamic focusing for cutting curved surfaces (radius ≥8 mm).Heat-affected zone (HAZ) <30 μm, critical for optical clarity.Case Study:Automotive uses a 30W system to cut LiDAR-grade fused silica lenses (1.2 mm thickness).1.3 Advanced Display ManufacturingMini/Micro LEDCutting 0.2 mm ultra-thin glass substrates (CTE <3.5×10/K) with 2 μm line accuracy.OLED Flexible Screens:Delicate cutting of glass encapsulation layers (50-100 μm) on PI substrates, using pulse energy <10 μJ to prevent delamination.1.4 Precision OpticsHigh-End Applications:Fluorophosphate optical glass (refractive index: 1.45-1.9) cutting for lenses and prisms.Infrared chalcogenide glass (e.g., Ge28Sb12Se60) for thermal imaging systems.Case Study:UK-based Renishaw utilizes a 25W picosecond laser to cut 80 mm diameter sulfur-basd glass lenses at 300 mm/s.2. Glass Types & Cutting Parameters MatrixGlass TypeKey PropertiesRecommended PowerThickness RangeCutting SpeedCritical ConfigurationsSoda-Lime Glass (Architectural)Hardness: 5.5 Mohs, CTE: 9×10/K80W0.5-8 mm200 mm/sNassist to prevent edge carbonizationBorosilicate Glass (Labware)Thermal resistance: 560°C, CTE: 3.3×10/K80W0.3-5 mm150 mm/sVacuum chuck to minimize thermal warpingFused Silica (Optical)Purity: 99.99%, Melting point: 1750°C80W0.1-10 mm80 mm/s532 nm green laser for optimal absorptionUltra-Thin Electronic GlassThickness: 0.05-0.3 mm, Flexural strength: >800 MPa80W0.05-0.5 mm500 mm/sAir-bearing stage to suppress microcracksChemically Strengthened GlassSurface compressive stress: >700 MPa80W0.3-2 mm300 mm/sBurst mode to penetrate stress layers 3. Power vs. Threshold GuidelinesGeneral Rule:Power (W) ≈ 2 × Glass Thickness (mm) + 10 (for standard soda-lime glass).Example: 2 mm glass → ~14W minimum power (add 20-50% buffer for complex shapes).Speed Adjustment:For every 0.1 mm thickness increase, reduce speed by 15-20 mm/s (for borosilicate). 4. Industry-Specific Technical HighlightsMedical Devices (US Market Focus):Cutting 1 mm bioactive glass (e.g., 45S5 Bioglass?) for endoscopic tools with zero toxic byproducts.Aerospace (UK/Germany Focus):3 mm aluminosilicate glass cutting for aircraft cabin windows (Ra <0.4 μm post-cutting).Renewable Energy (US/Germany):CdTe thin-film solar glass cutting using 20W + fume extraction to prevent Cd release. Model number: HS-Pi50 /HS-Pi60 /HS-Pi75 / HS-Pi80 /HS-Pi90Power supply:Single-phase 220V±10%, 50/60Hz ACLaser power:50W 60W 75W 80W 90WWhole machine power consumption:Laser type: Picosecond laser and RF co2 laserWorking environment humidity:20-26°CLaser wavelength: 1064±5nmControl system:HS LASER (customized )Support English operation systemWorking area: Standard 600x700mm double working tableCNC machine bed:Plate sheet welding Repetition Rate:Single Shot to 8 MHzWorking desk:Marble countertop Spatial Mode: M^2 < 1.3Pulse Width Measured at 1064nm: 10 picosecondsPointing Stability Over Constant Temperature +/2 °C: < 50 μrad / °CMachine weight:>5tonPicosend cutting speed:500mm/sLaser cutting head:Bessel Detailed Photos
Purchasing Agent
Note: Send your message to supplier or manufacturer.
Welcome to our Professional and comprehensive procurement services...
Message:
OK ! We suggest you detail your product requirements and company information here.
Enter between 20 to 4,000 characters.
Your inquiry content must be between 20 to 4000 characters.