IPDB › China Industry › Manufacturing & Processing Machinery › Manufacturing Equipment for Electrical & Electronic Product
Semiconductor Packaging Die Bonder Bonding Machine Eutectic Crystal Planting Machine1
Manufacturing Equipment for Electrical Electronic Product, Die Bonder, Die Bonding Machine
Guangzhou Minder-Hightech co.,Ltd
Preview:
Product DescriptionOne-stop Professional Equipments Solution for Semiconductor and Electronic IndustryAll equipment needs to be customized according to your samples. Please consult our sales engineers for details.Product DescriptionIC/TO Package Equipment Die BonderAutomatic Die Bonder Automatic Upload and DownloadAutomatic Die Bonder Manual Upload and doDwn LoadDual Head High Speed Die BonderAutomatic Die Bonder Automatic Upload and DownloadApplicable to SMD2020 1010 2121 2835 5730, filament, etcMDDB-LA838 Die attachDual Head High Speed Die BonderFactory and Equipment Real ShotSpecification360i-8 inch Die bonder Technical specificationSolid CrystalWorktable (Linear Module)Optics SystemWorktablestroke100x300mmCameraResolution1μmOpticsMagnifier (wafer) 0.7 times to 4.5 times0.7~4.5Die Workbench(Linear Module)Cycle Time200MS/EAXY stroke8"*8"Die bonding cycle is less than 250 milliseconds, production capacity is greater than 12k;12kResolution1μmWaferplacement accuracyLoading and unloadingmoduleAdhesive dieposition x-y±2milUsevacuum sucker to automatically feedRotationaccuracy±3°Use box cartridgereceipt to unloadingPneumatic plate clamp, bracket width adjustment range of 25 ~ 90mm 25~90mmDispensingmoduleEquipmentRequireSwing armdispensing + heating systemVoltageAC220V/50HZDispensing needle set can be exchanged by single or multiple needleAir Sourceminimum 6BARVacuum Source700mmHG(Vacuum pump)PR SystemDimensions AndWeightMethod256 grey levelsWeight450kgDetectionink/chipping/cracked dieSize(DxWxH)1200*900*1500mmMonitor17"LCDMonitorResolution1024*768Missing DieVacuum Sensor380-12 inch Die Bonder Technical SpecificationsFixation worktable (linear module)Fixation worktable (linear module)CameraWorktable travel 100x300mmWorktable travel 100x300mmOpticalmagnification (crystal element) 0.7x~4.5xResolution 1 u mResolution 1 u mWafer worktable (linear module)Wafer worktable (linear module)The solidification period is less than250 milliseconds, and the production capacity is greater than 12k;XY travel 12”*12XY travel 12”*12Resolution 1 umResolution 1 umWafer placement accuracyWafer placement accuracyAutomatic feeding method using vacuumsuction cups for feedingGlue position x-y ±2milRotation accuracy ±3°Glue position x-y ±2milRotation accuracy ±3°Material box container type materialcollection is used for material cuttingUsing pneumatic pressure plate fixtures,the width adjustment range of the bracket is 25~90mmGlue dispensing moduleGlue dispensing moduleUse swing arm glue dispensing + heatingsystemUse swing arm glue dispensing + heatingsystemGlue dispensing needle group can beinterchanged with single needle or multi-needleGlue dispensing needle group can beinterchanged with single needle or multi-needlePR SystemPR SystemMethod: 256 grey levelsMethod: 256 grey levelsMonitor 17"Monitor 17"Monitor Resolution: 1024*768Monitor Resolution: 1024*768Packing & DeliveryCompany ProfileMinder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. We are comprised by a group of high educated specialists, experienced engineers and staffs, with excellent professional skills and experience.Our main products include: Die bonder, Wire bonder, Wafer grinder, Dicing saw, Plasma surface treatment, Photoresist removing machine, Rapid Thermal Processing, RIE, PVD, CVD, ICP, EBEAM, Parallel sealing welder, Terminal insertion machine, capacitor winding machine, Bonding tester, etc.Until today, our brand's products have spread to major industrialized countries around the world, helping customers improve efficiency, reduce costs, and improve product quality.FAQ1. About Price:All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device. 2. About Sample:We can provide sample production services for you, but you may provide some fees. 3. About Payment:After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it. 4. About Delivery:After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment. 5. Installation and Debugging:After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee. 6. About Warranty:Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price. 7. After-sale Service:All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.
Purchasing Agent
Note: Send your message to supplier or manufacturer.
Welcome to our Professional and comprehensive procurement services...
Message:
OK ! We suggest you detail your product requirements and company information here.
Enter between 20 to 4,000 characters.
Your inquiry content must be between 20 to 4000 characters.