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Solder Paste / Perform Vacuum Soldering Oven for Chip packaging in R&D1
Manufacturing Equipment for Electrical Electronic Product, Vacuum Furnace, Vacuum Reflow Oven
Termway (Beijing) Precision Technology Co., Ltd.
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Product Description Chip packaging Compact Soldering System with Water Cooling R&D RS220Function Introduction:1. RS220 Vacuum Reflow Oven is the third generation of its small Vacuum Reflow Oven (eutectic furnace). It especially designed for the fields in small batch production, R&D and functional materials test, etc.RS220 Vacuum Reflow Oven (eutectic furnace) meets the requirements of heating in vacuum, nitrogen and reducing atmosphere (formic acid) to achieve void-free solder, which can fully meet the requirements of R&D department for testing and small batch production.RS220 Vacuum Reflow Oven (eutectic furnace) can minimize the void rate 1% , while the average reflow oven void range is around 20%.RS220 vacuum reflow (eutectic furnace) can be used in all types of solder paste processes, as well as fluxless soldering (solder perform) process. The inert protective gas nitrogen can be used, or the formic acid or nitrogen-hydrogen mixture can be used for the reduction application.RS220 vacuum reflow (eutectic furnace) software control system, simple operation, can connect control equipment and set various welding process curves, and set, modify, store and recall according to different processes; software comes with analysis function, the process curve can be analyzed to determine information such as temperature rise, constant temperature, and temperature drop. The software control system automatically records the welding process and the temperature control and temperature measurement curves in real time to ensure the traceability of the device process.2. RS220 vacuum reflow oven is mainly for some highly demanding soldering fields, such as industrial grade high reliability products, For materials testing, chip packaging, power equipment, automotive products, train control, aerospace, aviation systems and other high-reliability soldering requirements.The voids and oxidation of solder materials must be eliminated or reduced. How to effectively reduce the void rate and reduce the oxidation of the pad or component pins, vacuum reflow soldering machine is the only choice. To achieve high soldering quality, vacuum reflow machine must be used. 3. Industry application: RS220 vacuum reflow soldering machine is the ideal choice for R&D, process research and development, low to high capacity production, and is the best choice for high-end R&D and production in research institutes, universities, aerospace and other fields.4. Application: Mainly used for defect-free soldering of chips and substrates, tube shell and cover plate,and perfect solderless soldering, such as IGBT package, solder paste process, laser diode package process, optical communication device soldering, SIP package, tube shell and cover plate package, MEMS and vacuum package.5. Vacuum reflow soldering oven has become an essential equipment for high-end manufacturing of industrial enterprises, aviation and aerospace in developed countries such as Europe and the United States, and has been widely used in chip packaging and electronic soldering.Features1. It can realize soldering under vacuum, nitrogen and reducing atmosphere. The 2-way process atmosphere system nitrogen and formic acid, nitrogen and formic acid are controlled by MFC mass flow meter, which precisely controls the input of process gas to ensure the consistency of each welding process.2. Temperature control system independently developed by ourself TORCH, temperature control accuracy ±1 °C; 2 flexible (patented technology) temperature sensor in the device cavity, real-time testing the temperature of heating plate surface and fixture surface or internal, surface of the device, provides temperature feedback for components soldering, and the number of temperature sensors can be increased according to customer needs.3. Use graphite material as heating platform to ensure temperature uniformity within the soldering area ≤±2%.4. Equipped with a mechanical vacuum pump, the vacuum can be up to 10-1Pa.5. The upper cover of the chamber is equipped with an observation window, which can observethe internal device changes in the cavity in real time.6. Through the patented water cooling technology, to achieve rapid cooling and cooling in the vacuum environment, the industry's fastest cooling effect.7. The self-developed temperature control software, up to the industry's 40-stage programmable temperature control system, can set the most perfect process curve.8. Closed cavity structure ensures long-term reliability. When the upper cover is closed during use, the device will not be displaced, avoid device vibration affecting the quality of the soldering.9. The unique water-cooling technology can ensure that the cavity is not overheated during welding, and at the same time. At the same time, the cooling of the heating plate is achieved during cooling, thereby improving the cooling efficiency.10. TORCH technology patented technology temperature control system, can ensure the consistency of the welding process, the temperature curve can be realistically repeated in the software system, through the coincidence of the process curve can determine the process consistency of the same process of the same product.11. Set the process curve by yourself and monitor the set process curve in real time. The process curve is set according to the process requirements (up to 6 sets of PID settings), the process steps are not limited; can be stored, modified, recalled, etc., in the process curve software. the process curve during welding is displayed in real time and automatically saved, which is convenient for the process traceability; the software has its own process curve analysis function to analyze the heating, constant temperature and cooling; The unique welding curve repeating display technology of the same process can prove the consistency of each sintering process by the coincidence of the process curve, ensuring that the device process of each soldering is consistent.12. The software has anti-error interlocking, over-temperature, over-pressure, time-out alarm and other protection functions. When the hardware of the device fails or the software is set incorrectly, the software automatically prompts and alarms to determine whether the process continues.Equipment ParameterModelRS220Soldering Size220mm*220mmChamber height100mm(other Hights is optional)Temperature450oC (higher is optional)ConnectorSerial 485 network / USBControl ModeSoftware control (temperature, pressure, etc.)Temperature curvecan store several curves Temperature of 40 segmentsVoltage220VRated Power9KWActual Power6KW(without vacuum pump)Dimension1000*1000*1300mmWight150KGmaximum heating rate120oC/minThe maximum cooling rateOnly water-cooled 60oC/min, Air-cooled + water-cooled 120oC/minCooling WayAir-cooled / water-cooled (shell, heating plate)
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