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Semiconductor Welding Equipment Vacuum Reflux Furnace Eutectic Reflow Soldering Oven System1
Manufacturing Equipment for Electrical Electronic Product, Vacuum Soldering, Vacuum Reflow Oven
Guangzhou Minder-Hightech co.,Ltd
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Product DescriptionAll equipment needs to be customized according to your samples. Please consult our sales engineers for details.Since 2014, Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. Product DescriptionMDVES200 Vacuum Eutectic Reflow Soldering Oven SystemMDVES400 Vacuum Eutectic Reflow Soldering Oven SystemThe design basis of the MDVES200 vacuum sintering furnace is vacuum and water cooling control, which can not only ensure the void rate, but also increase the cooling rate.The standard gas of MDVES200 includes: nitrogen, nitrogen-hydrogen mixed gas (95%/5%) and formic acid. The customer selects the corresponding gas as the process gas according to his actual situation, and does not need to worry about the additional configuration. The PLC control system of the equipment can well monitor the operations of vacuum pumping, inflation, heating control, and water cooling to ensure the stability of the customer's process.MUX200 is a 10L cavity, the cost performance of the product is relatively high, which can meet the needs of research and production customers.The design basis of the MDVES400 vacuum sintering furnace is vacuum and water cooling control, which can not only ensure the void rate, but also increase the cooling rate.The standard gas of MDVES200 includes: nitrogen, nitrogen-hydrogen mixed gas (95%/5%) and formic acid. The customer selects the corresponding gas as the process gas according to his actual situation, and does not need to worry about the additional configuration. The PLC control system of the equipment can well monitor the operations of vacuum pumping, inflation, heating control, and water cooling to ensure the stability of the customer's process.ApplicationIGBT modules, TR components, MCM, hybrid circuit packages, discrete device packages, sensor/MEMS packages (water-cooled), high-power device packages, optoelectronic device packages, air-tight packages (water-cooled), eutectic bump welding, etc.Factory and Equipment Real ShotSome of SampleSpecificationMDVES200 Structure sizeBasic frame820*820*1000mmcavity volume10LMaximum height of base110mmObservation windowincludeWeight220KGVacuum systemVacuum pumpVacuum pump with oil pollution filtering deviceVacuum levelUp to 5PaVacuum configuration1. Vacuum pump2. Electric valvePumping speed controlThe pumping speed of the vacuum pump can be set bythe host computer softwarePneumatic systemProcess gasN2, N2 / H2 (95% / 5%), HCOOHFirst gas pathNitrogen/nitrogen-hydrogen mixture (95%/5%)Second gas pathHCOOHHeating and cooling systemHeating methodRadiant heating, contact conduction, heating rate 150℃/minCooling methodContact cooling, the maximum cooling rate is 120℃/minHot plate materialcopper alloy, thermal conductivity:≥200W/m·℃Heating size240*210mmHeating deviceHeating device: the vacuum heating tube is used; the temperature is collectedby the Siemens PLC module, and the PID control is controlledby the host computer Advantech.Temperature rangeMax 400℃Power requirements380V, 50/60HZ three-phase, maximum 40AControl SystemSiemens PLC + IPCEquipment powerCoolantAntifreeze or distilled water≤20℃Pressure:0.2-0.4Mpacoolant flow rate>100L/minWater tank water capacity≥60LInlet water temperature≤20℃Air source0.4MPa≤air pressure≤0.7MPaPower supplysingle-phase three-wire system 220V, 50HzVoltage fluctuation rangesingle phase 200-230VFrequency fluctuation range50HZ±1HZEquipment power consumptionabout 5KW; grounding resistance≤4Ω;MDVES400 Structure size Basic frame1260*1160*1200mmMaximum height of base90mmObservation windowincludeWeight350KGVacuum systemVacuum pumpVacuum pump with oil pollution filtering device optional dry pumpVacuum levelUp to 10PaVacuum configuration1. Vacuum pump2. Electric valvePumping speed controlThe pumping speed of the vacuum pump can be set by the host computer softwarePneumatic systemProcess gasN2, N2 / H2 (95% / 5%), HCOOHFirst gas pathNitrogen/nitrogen-hydrogen mixture (95%/5%)Second gas pathHCOOHHeating and cooling systemHeating methodRadiant heating, contact conduction, heating rate 150℃/minCooling methodContact cooling, the maximum cooling rate is 120℃/minHot plate materialcopper alloy, thermal conductivity:≥200W/m·℃Heating size420*320mmHeating deviceHeating device: the vacuum heating tube is used; the temperature is collected by the Siemens PLC module, and the PID control is controlled by the host computer Advantech.Temperature rangeMax 450℃Power requirements380V, 50/60HZ three-phase, maximum 40AControl SystemSiemens PLC + IPCEquipment powerCoolantAntifreeze or distilled water≤20℃Pressure:coolant flow rate>100L/minWater tank water capacity≥60LInlet water temperature≤20℃Air source0.4MPa≤air pressure≤0.7MPaPower supplysingle-phase three-wire system 220V, 50HzVoltage fluctuation rangesingle phase 200-230VFrequency fluctuation range50HZ±1HZEquipment power consumptionabout 18KW; grounding resistance≤4Ω;Packing & DeliveryCompany ProfileMinder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. We are comprised by a group of high educated specialists, experienced engineers and staffs, with excellent professional skills and experience.Our main products include: Die bonder, Wire bonder, Wafer grinder, Dicing saw, Plasma surface treatment, Photoresist removing machine, Rapid Thermal Processing, RIE, PVD, CVD, ICP, EBEAM, Parallel sealing welder, Terminal insertion machine, capacitor winding machine, Bonding tester, etc.Until today, our brand's products have spread to major industrialized countries around the world, helping customers improve efficiency, reduce costs, and improve product quality.FAQ1. About Price:All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device. 2. About Sample:We can provide sample production services for you, but you may provide some fees. 3. About Payment:After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it. 4. About Delivery:After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment. 5. Installation and Debugging:After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee. 6. About Warranty:Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price. 7. After-sale Service:All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.
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