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Automatic CCD Visual Glue Dispenser Machine1
Manufacturing Equipment for Electrical Electronic Product, Automatic CCD Visual Glue Dispenser, Glue Dispenser Machine
Jiangsu Himalaya Semiconductor Co., Ltd.
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Product Description Automatic CCD Visual Glue Dispenser Machine semiautomatic Three-Axis Desktop Dispensing Robot equipment factory Product DescriptionStandard Features Computer Control, Windows OSCCD visual positioning systemServo MotorUPS and voltage stabilizerESD grounding point-CE certifed Optional Features Automatic constant temperature system to ensure the fuidity consistentLaser Height Detection to calibrate Z axis automatically for componentdeformationProduct advantage:TSV Series desktop dispensing system is applicable for LENS dispensing, FPC package, SMT red glue dispensing, solder past dispensing, LED package, fingerprint identifcation module, etc. Specifications TSV-300 HSV-300Dimension (mm) L810×W660×H760 L900×W650×H1460Weight (kg) 105 190Control Industrial personal computer + motion control cardSoftware Anda control software + windows systemProgramming Visual programmingNumber of spindles X,Y,ZSpindle drive Servo motor + moduleWorking area (mm) X:260 ; Y:260 ; Z:100Quantity of rubber valve 1 (standard configuration)Max. Moving speed (mm/s) 800Repeatability (mm) ± 0.025Coating capacity (cc) 30Valve nozzlecleaning device Vacuum cleaningEquipment alarm Menu + sound and light alarmCoating inspection Automatic detectionPower supply 220V 50/60HzRequired air pressure (Mpa) ≥ 0.65Safety standards CERated power (kw) 1Standard configuration CCD visual positioning; Electrostatic interface; 232 scanner socketExhibition & CustomersJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.Packaging & Shipping FAQQ1:How to choose a suitable machine?A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. Q2:What is the warranty period for the equipment?A2:One year warranty and 24 hours online professional technical support.Q3:Why choose us ?A3:OEM/ODM/Designing.
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