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Electronic 96% 99.6% Aluminum Oxide Sheet Thin Thick Film Circuit Al2O3 Plate High Alumina Ceramic Substrate for Semiconductor1
Industrial Ceramic ProductsCeramic SubstrateAlumina Substrate
SHENZHEN JINGHUI INDUSTRY LIMITED
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Product Description Electronic 96% 99.6% Aluminium Oxide Sheet Thin Thick Film Circuit Al2O3 Plate High Alumina Ceramic Substrate for SemiconductorManufacturing Capacity1. Product SpecificationThe table below shows our standard sizes. If you need customization, please contact us.Alumina Ceramic Substrate99.6% Al2O3Thickness (mm)Maximum Size (mm)ShapeMolding TechniqueAs FiredLappedPolishedRectangularSquareRound0.1-0.2 50.850.8 √√Tape Casting0.25 114.3114.3 √ Tape Casting0.38120114.3114.3 √ Tape Casting0.5120114.3114.3 √ Tape Casting0.635120114.3114.3 √ Tape CastingOther special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping.96% Al2O3Thickness (mm)Maximum Size (mm)ShapeMolding TechniqueAs FiredLappedPolishedRectangularSquareRound0.25120114.3114.3 √ Tape Casting0.3120114.3114.3 √ Tape Casting0.38140×190 √ Tape Casting0.5140×190 √ Tape Casting0.635140×190 √ Tape Casting0.76130×140 √ Tape Casting0.8130×140 √ Tape Casting0.89130×140 √ Tape Casting1280×240 √ Tape Casting1.5165×210 √ Tape Casting2500×500 √ Tape CastingOther special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping.2. Product TolerancesAlumina Ceramic SubstrateItemSubstrate Thickness (mm)Standard Tolerance (mm)Best Tolerance (mm)Laser Cutting Tolerance (mm)Length and Width Tolerance/±2 ±0.15Thickness ToleranceT<0.3±0.03±0.01 0.30-1.0±0.05±0.01 T>1.0±10%±0.01 3. Surface RoughnessAlumina Ceramic SubstrateMaterialSurface Roughness (μm)As FiredLappedPolished96% Al2O3Ra 0.2-0.75Ra 0.3-0.7Ra ≤0.0599.6% Al2O3Ra 0.05-0.15Ra 0.1-0.5Ra ≤0.054. Laser Processing(1) Hole SizeAlumina Ceramic SubstrateHole Diameter (mm)Standard Tolerance (mm)φ≤0.50.08φ>0.50.2(2) Laser ScribingAlumina Ceramic SubstrateSubstrate Thickness (mm)Laser Scribe Line Depth to Thickness (%)0.2-0.340%±5%0.3<T≤0.550%±3%0.5<T≤1.043%±3%1.255%±3%1.555%±3%2.055%+10%The scribing spot can be in different sizes. Generally, there are small spots 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spots 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm. Product FeaturesCeramic substrates are ideal packaging base materials for new generation integrated circuits and power electronic modules. Compared with plastic and metal substrates, ceramic substrates have the following advantages.1. Good InsulationGenerally speaking, the higher the substrate resistance, the better the reliability of the package. Ceramic materials are generally covalent bond compounds with better insulation properties.2. Low Dielectric Coefficient and Good Frequency PerformanceThe low dielectric constant and dielectric loss of ceramic materials can reduce the signal delay time and increase the transmission speed.3. Small Coefficient of Thermal Expansion (CTE)Covalent bond compounds generally have high melting points, and the higher the melting point, the smaller the thermal expansion coefficient, so the CTE of ceramic materials is generally small.4. High Thermal ConductivityCeramic substrate materials are widely used in aviation, aerospace, and other engineering projects for high-reliability, high-frequency, high-temperature-resistant, and highly airtight product packaging. The packaging of ceramic substrate materials is generally a multilayer ceramic substrate package, which is widely used in hybrid integrated circuits (HIC) and multi-chip module (MCM) ceramic packages.Material Properties Alumina Ceramic SubstrateItemUnit96% Al2O399.6% Al2O3Mechanical PropertiesColor//WhiteWhiteDensityDrainage Methodg/cm3≥3.70≥3.95Light Reflectivity400nm/1mm%9483Flexural StrengthThree Point BendingMPa>350>500Fracture ToughnessIndentation MethodMPa·m1/23.03.0Vickers HardnessLoad 4.9NGPa1416Young's ModulusStretching MethodGPa340300Water Absorption %00Camber/Length‰T≤0.3: ≤5‰, Others: ≤3‰≤3‰Thermal PropertiesMax. Service Temperature (Non-loading)/oC12001400CTE (Coefficient of Thermal Expansion)20-800oC1×10-6/oC7.87.9Thermal Conductivity25oCW/m·K>24>29Thermal Shock Resistance800oC≥10 TimesNo CrackNo CrackSpecific Heat25oCJ/kg·k750780Electrical PropertiesDielectric Constant25oC, 1MHz /9.49.8Dielectric Loss Angle25oC, 1MHz ×10-4≤3≤2Volume Resistivity25oCΩ·cm≥1014≥1014Dielectric StrengthDCKV/mm≥15≥15 Product Applications1. 96% Alumina96% alumina is the standard material for thick film circuit substrates. It has excellent electrical insulation properties, mechanical strength, good thermal conductivity, chemical durability, and dimensional stability. Its surface roughness is generally 0.2-0.6 μm, and the maximum operating temperature of the substrate can reach 1600°C. 2. 99.6% Alumina99.6% alumina is the primary material used in most thin-film circuit substrates. It has higher purity and smaller grain size. When made into a substrate, it has the advantage of excellent surface smoothness (surface roughness generally 0.08- 0.1um), and the max. The operating temperature of the substrate can reach 1700°C.Production ProcessProduct InspectionProduct RecommendationsWe offer bare ceramic substrates in various raw materials, sizes, shapes, and thicknesses. Welcome to communicate with us.View More
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