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Advanced Boron Nitride Heat Sink for Superior Cooling Performance1
Industrial Ceramic ProductsHigh-Performance PlateBoron Nitride Plate
TIANJIN YINGHUA NEW MATERIAL TECH CO., LTD.
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Product Description Boron nitride (BN) has high melting point, thermal conductivity, good insulation, high bending strength, good thermal shock resistance and chemical corrosion resistance. At high temperature, BN still has stable high frequency dielectric properties. The most unique advantage of BN is that it can be machined into porcelain with complex shape and high precision. Therefore, it is widely used in composite conductive ceramic evaporation boat, high temperature crucible, sputtering target, high temperature high frequency and plasma arc electric insulator, electronic module heat dissipation device, traveling wave tube collection and radiator, transistor heat sink, Semiconductor packaging heat dissipation substrate, high frequency induction furnace materials and atomic reactor structural materials, protective Photoelectric radiation, chemical radiation, nuclear radiation materials and radar transfer windows.The main results are as follows: 1) BN is the only machinable ceramic with a precision of 0.01mm;the insulation strength is 2300v / cm,8 times of Al2O3, the RT resistance is more than 1014 Ω. Cm at 1000 oC. the melting point is as high as 2800 oC.excellent heat resistance impact, from 20 oC to 1000 oC return 100 times without damage; General metals (iron, copper, aluminum, lead, etc.), rare earth metals, precious metals, semiconductor materials (germanium, silicon, potassium arsenide), glass, molten salts (crystal, fluoride, slag), inorganic acids, alkali. Typical applicationHigh purity boron nitride crucible for molten metalNitride phosphors, silicon nitride, aluminum nitride and other ceramics and powder sintering crucible, sintering board.Electrode Insulation and Protective Pipe for High temperature Furnace Boron nitride insulation assembly for polysilicon ingot furnaceBoron Nitride Ceramics PropertiesColorWhiteDensity2.0g/cm3Melt Point2800oCBending Strength35MPaThermal Conductivity75 W/m.KThermal expansion coefficient -1.0~2.5×10-6 K-1Application Tem(Max)2200oC(inert)Volume resistivity1014Ω.cmDielectric constant4.0@1Hz Hardness(Mohs)2
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