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Customized Al2O3 Oxide Aluminum Nitride Ceramic Coating Amb Substrate Copper Silver Ni Ti Various Metal Materials Direct Bond Copper Active Metal Brazing Sheet1
Industrial Ceramic ProductsCeramic SubstrateAmb Substrate
Shenyang Vhandy Technology Co., Ltd
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Product DescriptionProduct DescriptionAluminum Nitride Ceramic AMB Copper-Clad SubstrateIts high thermal conductivity of 160 to 180 W/m·K makes it ideal for heat dissipation applications. Its coefficient of thermal expansion is well matched to silicon, making it useful in electronic packaging and semiconductor substrates. Its high volume resistivity and high dielectric withstand voltage make it widely used in high-voltage equipment and power systems. Its high wear resistance and excellent chemical stability make it suitable for components requiring long-term durability. Its high resistivity and low dielectric loss make it an ideal electrical insulation material.Applied Area- Automotive: ABS, Power Steering, DC/DC Converter, LED Lighting, Ignition Control Power Electronics: IGBT, MOSFET, Thyristor Module, Solid-state Relay, Diode, Power transistors - Home Appliance: Air Conditioner, Peltier Cooler - Industrial: LED Displays, Welding Machine- Aerospace: Laser, Power Supply for Satellites and Aircrafts - Environmental Technology: Local Power Generation, Electric Vehicle, Traction Control System, Photovoltaic Units, Wind Power- PC/IT: Power Supply, UPS SystemMechanical PropertiesMaterialAINDimensions190*138mmCustomizableThickness0.635mmCustomizableDensity3.3g/cm3Surface RoughnessRa≤1.5um; Rz≤10umGrindableWarp≤200umWetability≥95%Flexural Strength≥350MPaElectrical CharacteristicsThermal conductivity≥170W/m·kCoefficient of thermal expansion4.7(20~ 300℃)10-6/KDielectric loss0.0005MHzDielectric constant9MHzDielectric strength≥20KV/mmResistivity1014Ω.cmViasHole diameter120~160umHole spacing≥0.2mmPositioning accuracy±150umHole to metal edge distance≥0mmHole to tile edge distance≥1mmCopper FoilPurity≥99%O2 contentOFHCHardness80~110HVConductivity98.3MS/mMotherboard PerformanceTotal Tolerance+0.2/-0.05mmCopper Edge to Porcelain Edge±0.15mmTotal Thickness± 5%Through Hole Diameter±0.1mmMaximum Active Area99%Paste PrintingMain ingredientsCu Ag TiThickness10~50umEffective printing area99%Surface TreatmentCoatingNi layer thickness2~10umAg layer thickness0.03~ 1.0umAu added layer thickness0.01~0.2umSolder MaskInk colorGreen, blackThickness10umPosition accuracy±150umDimensional accuracy±100umHeat resistance300°C, 30 minutes, no peelingAdhesion3M tape test, no peelingProduct PerformanceHot and cold cycle(-40°C/air to 170°C/air)≥1000 times (no delamination)Void rate (ultrasonic scanning)≤0.01% (200um resolution)Pattern specifications and spacingCopper plate thickness (mm)Spacing (mm)Minimum size (mm)0.20.350.70.250.40.80.30.510.40.61.20.50.71.40.812Tile marginCopper plate thickness (mm)Ceramic margin (mm)0.2A≥0.200.25A≥0.250.3A≥0.300.4A≥0.400.5A≥0.450.8A≥0.50Our FactoryPacking & DeliveryFAQQ: Are you trading company or manufacturer?A: We are manufacturer.Q: How long is your delivery time?A: Generally within 30 working days, it is according to quantity.Q: Do you provide samples? Is it free or extra?A: The samples can be provided, but the shipping cost should be on buyer's account.Q: What is your term of payment?A: Payment<=10000 USD, 100% in advance. Payment>=10000 USD, 70% T/T in advance, balance before shipment.
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