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Versatile Diamond Wire Cutting Equipment for Enhanced Performance Cutting Machine1
Diamond ToolsCutting MachineWire Cutting Machine
HENAN RUNJING INSTRUMENT EQUIPMENT CO.,LTD
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Product Description 1. Equipment Name & ModelFully Automatic Diamond Wire SawModel: RJ-DWC150-AType: Continuous Cutting System2. Core Technology & FeaturesDiamond Wire Cutting TechnologyMotion Mode: Single Wire Reciprocating MotionWire Length: ≤270mTension System: Pneumatic Tensioning System (0-1MPa adjustable)Precision ControlDimensional Accuracy: ±10μmAxis Control: Y/Z/R-axis Stepper MotorsWorktable Rotation: 360° Programmable Rotation3. Compatible MaterialsCeramics: Alumina/Zirconia, Semiconductor CeramicsCrystals: Sapphire, Silicon, SiC, CsIGlass: Optical/Quartz, ChalcogenideMetals: Ti/Fe/Al Alloys, FerriteBiomedical: Tissue Specimens, Bone-Implant SamplesOthers: Thermoelectric , IR Optical (ZnSe)4. Technical SpecificationsParameterSpecificationMax Cutting Size?150mm × 150mm (6")Wire Diameter≤0.45mm (options: 0.125-0.42mm)Wire Speed0-4m/s adjustablePower Supply220V 50Hz, <550WDimensions600×600×1100mmWeight~500kg5. Key ComponentsStandard Accessories:Tension Wheels (2 pcs)Guide Wheels (2 pcs)Diamond Wire (2 rolls)Cooling Pump (1 unit)Optional Accessories:Swing Mechanism (for hard materials)Heating StageDX-100 Single Crystal Orientator6. ApplicationsSemiconductor: Wafer dicingGem Processing: Jade/Sapphire cuttingResearch: Geological sample preparation7. Key AdvantagesHigh Efficiency: Long-life diamond wire (≤270m)Precision: ±10μm tolerance, digital axis controlVersatility: Cuts hard/brittle materials and soft tissues
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