CIPDB › China Industry › Tools & Hardware › Diamond Tools
Long Life R15c Series Silicon Wafer Perimeter Blades Used for Bonded Die Edge Trimming1
Diamond ToolsPerimeter BladeDicing Blade
Zhengzhou Hongtuo Precision Tools Co., Ltd.
Preview:
Product Description The R15C series blade was developed by Hongtuo for wafer trimming. Not only ensures higher quality but also further enhances the wear resistance of the blades, breaking the traditional characteristic that both quality and lifespan are difficult to improve simultaneously.The R15C adopts a special processing technique to perform shallow treatment on the side of the blade, which can further enhance the cutting quality.Hongtuo can provide customers with cost-effective solutions to achieve cost reduction and efficiency improvement.Product NameTrimming BladeFeaturesLong life & High wear resistance.AbrasiveDiamondApplicationsWaferBond TypeResinSampleAvailableSizeCustomizedGrit size320-2000#
Purchasing Agent
Note: Send your message to supplier or manufacturer.
Welcome to our Professional and comprehensive procurement services...