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8 Inches Fully Automatic Wafer Grinder Dfg85601
Grinder, 8 Inches Wafer Grinder, Precision Thickness Grinding
Ninghai County Chalu Jinbaili Daily Necessities Store
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Product Description Fully automatic wafer grinder HG5260HG5260 wafer grinder is a fully automatic thinning machine with two spindles and three chuck tables, automatic wafer pick, loading/unload ing, equipped with a high rigidity air bearing grind spindle, a four-axis clean room robot arm, and a large-range high-resolution thickness gauge, etc. The machine is compatible with the thinning of 8/12inch wafers and realizes automatic wafer size switching without hardware replacement.Features:Large dimension movement with reliable running stability 15 inches high sensitivity LCD screen, user friendly GUI High power, high rigidity spindle, low vibration, rotation speed range 1000-4000rpm High precision thickness guage, measuring range of 0-2.4mm, with resolution 0.1um,Repeatablity: ±0.5umMin wafer thickness grind to 100um, back side TTV≤3um atfer grinding, Surface roughness Ra≤0.02um (#2000 grinding wheel) Automatic 4-axes wafer pick robot arm for clean room Strong two-fluid cleaning technology for wafer backside IPC bus control mode, faster response time, more scalable abilityPortable HMI operating handle for easy machine operation and maintenance Z1 grinding line designed overlap with Z2,improving backside grinding pattern quality, and stability Automatic adjustment of TTV on the grinded wafer surfaceConfiguration: Work piece size(inch)8/12 inchesZ Axis Stroke(mm)120In-feed speed (mm/s)0.0001-0.080Min index resolution(mm)0.1 Utilities Power(kVA)18KVA(three phase,200V) Air pressure(MPa L/min)0.5~0.8Max consumption≥400 Wheel coolant(MPa L/min)0.3~0.4Max consumption≥25 Spindle coolant(MPa L/min)0.3~0.4Max consumption≥6.0 Duct(m3/min) ≥4.0 Foot print W*D*H(mm) 1400*3300*1800 Weight(kg) 5000
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