Heavy-Duty Polished Technical Round Ceramic Polishing Grinding Disc for Industrial Production¹

Product Description Product DescriptionCeramic Grinding DiscPrecision Craftsmanship, Achieving Perfection in Grinding        Core AdvantagesHigh-Efficiency Grinding: Utilizes premium alumina abrasives with high hardness and exceptional wear resistance, significantly enhancing grinding efficiency.Long-Lasting Durability: Treated with specialized processes, the disc features a compact structure and extended service life, reducing operational costs.Wide Applicability: Suitable for rough grinding, fine grinding, and polishing of various metal and non-metal materials.Stable and Reliable Performance: Resistant to clogging during grinding, ensuring consistent and stable grinding results.      Application ScenariosThe wafer ceramic grinding disc is a critical process equipment used in semiconductor manufacturing, primarily for flattening and polishing hard materials such as silicon wafers.      Technical HighlightsUnique Formulation: Optimized abrasive ratio to improve grinding efficiency and surface finish.Advanced Manufacturing Process: High-temperature sintering technology enhances the strength and wear resistance of the grinding disc.Precision Machining: Strict control over dimensional accuracy and dynamic balance ensures smooth and stable grinding operations.Notes: Regular product samples charge a sample fee, and special ones charge a development fee (specifically based on the drawings and quantity).Product ParametersCeramic PlatesRegulationUnit Priceabrasive diskΦ485*16mm$414.86 abrasive diskΦ230*12mm$551.54 abrasive diskΦ360*15mm$687.00 abrasive diskΦ520*20mm$687.00 abrasive diskΦ546*15mm$414.86 Ceramic plateΦ127*5.1mm$109.92 Ceramic plateΦ110*5mm$109.92 abrasive diskΦ576*20mm$687.00 Turntable307*Φ302*15mm$274.40 Main ProductsCompany ProfileWorkshopCertificationsExhibitionPackaging & Shipping

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