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Poly Diamond Alumina Silica CMP Sapphire Polishing Slurry1
Abrasive Grinding, Non Woven Abrasives, Polishing Suspension, Polishing Slurry
SIGNI INDUSTRIAL (SHANGHAI) CO., LTD.
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Product Description CMP Polishing Suspension for Metallographic Specimens Polishing 1. Appearance:White water base suspension2. Application: Polishing semiconductor wafers, precision ceramic, metal and other materials. 3. Specification: Size (micron)0.30,0.20,0.15,0.10PH11-133.5-4.5Content %19-2229-31Suspensibilitygoodgood4. Characteristics:(1) High purity alumina particles dispersed in deionized water medium(2) Higher hardness makes it have good grinding performances than silica polishing slurry, not only can achieve higher grinding effect, but also can get better surface roughness.5. Package:500g/bottle; 5kg/barrelSIGNI Chemical Mechanical Polishing (CMP) Slurries are colloidal silica liquid made of high purity deionized water, highly engineered chemical additives and abrasives that chemically and mechanically interact with work piece surface to remove excess materials, therefore smooth or flatten the surface. They are widely used for nanometer scale chemical mechanicalpolishing fields such as silicon wafers, compound crystals, optical apparatus, and sapphire polishing. The slurries have a wide range of diameter from 10 to 150 nm to meet different requirements. There are alkaline and acidic slurries based on the pH.SIGNI CMP slurries are developed under the concepts of high purity, high removal rate, high dispersion and scratch-free performance. Signi supplies CMP polishing slurry to customers around the world and is the most competitive in quality and price. FeaturesHigh speed polish: with large particle of colloidal silica (Grit size up to 150 nm)Controllable size: a wide range of custom-graded colloidal silica slurries from 10 to 150 nm that suits individual needs and applicationsHigh purity: the content of Cu2+<50 ppb, without contamination on the work piece Super-smooth polishing: with the particle of SiO2, avoid scratch on the object surfaceTypical PropertiesAlkaline TypepH: 9.8±0.5SOQ-2SOQ-4SOQ-6SOQ-8SOQ-10SOQ-12Acidic TypepH: 2.8±0.5ASOQ-2ASOQ-4ASOQ-6ASOQ-8ASOQ-10ASOQ-12Grit Size(nm)10~3030~5050~7070~9090~110110~130AppearanceMilk white or semitransparent liquid Density (g/ml)1. 15±0.05 ComponentContent(wt%)SiO215~30Na2O≤0.3Heavy metal impurity≤50 ppb Silica Wafer Polishing Reference DataPolishing Pressure150 ~ 250 g/cm2Polishing Temperature32 ~ 40 °C (89 ~ 104 °F) Dilution 1:1 - 20Polishing duration3 ~ 6 minutes Packaging: 500 ml/bottle, 25 kg or 200 kg/barrel. Customizations are available upon requests. Storage: Keep the stored temperature at 0~35oC (32~95 °F). Frozen can result in irreversible product degradation below 0oC. High temperature above 35 oC may accelerate the growth of micro-organisms and gelation, as well as decrease the long-term stability of the silica sol. Generally, the storage time of alkaline slurries is about two years and of acidic slurries is about half a year.
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