IPDB › China Industry › Tools & Hardware › Abrasive & Grinding
Diamond Grinding Wheels, Diamond Grinding Pad1
Abrasive Grinding, Other Abrasive Grinding Tools, Diamond Grinding Pad, Diamond Grinding Wheel, Grinding Pads
JIANGSU ALSTON TOOLS CO., LTD.
Preview:
Product Description Diamond cutting wheel (also called diamond grinding wheel or cutting disc) is an efficient tool that uses diamond particles as abrasives and is designed for cutting and grinding superhard materials. The following is a comprehensive analysis of it:1. Structure and principleComposition:Diamond abrasive grains: artificially synthesized single crystal/polycrystalline diamond, extremely high hardness (Mohs 10), responsible for cutting.Binder: metal (such as cobalt, nickel), resin, ceramic or electroplating layer, fixes the abrasive grains and transmits cutting force.Matrix: usually a steel disc or mesh structure, providing support.Working principle: When rotating at high speed, the exposed part of the diamond particles micro-cuts the material, and the binder gradually wears away to expose new abrasive grains and keep them sharp.2. Core advantagesHigh efficiency and durability: The life span is dozens of times that of ordinary grinding wheels, suitable for mass processing.High precision: the cut is smooth and reduces material loss (such as precision ceramics and semiconductor cutting).Versatility: It can process materials that are difficult to process with traditional tools, such as glass, tungsten carbide, gemstones, concrete, etc.Low thermal damage: Under reasonable use, the heat dissipation is fast, reducing the thermal deformation of the workpiece.III. Main typesClassification by binder:Metal binder: Strong wear resistance, suitable for hard and brittle materials (stone, concrete).Resin binder: Good elasticity, used for precision polishing (optical glass, ceramics).Electroplating type: Single layer diamond, suitable for small batch or special-shaped processing.Classification by shape:Parallel grinding wheel, cup grinding wheel, disc cutting disc, ultra-thin saw blade (0.1mm thickness for wafer cutting).IV. Selection guideMaterial matching:Granite/marble: Select metal binder + coarse grain (20/30 mesh).Carbide: Fine grain resin grinding wheel (above 100 mesh) + coolant.Glass/silicon wafer: High concentration electroplated diamond ultra-thin sheetParameter considerations:Grit size: coarse grain (fast slotting) vs fine grain (smooth surface).Concentration: diamond ratio (usually 75%-100%), high concentration prolongs life but costs more.Speed matching: It is strictly forbidden to exceed the maximum speed of the grinding wheel to prevent explosion.V. Use and maintenanceSafe operation:Wear goggles, dust masks, and install protective covers on the equipment.Start the machine and run it idle for 1 minute to confirm that there is no abnormal vibration.Cutting skills:Maintain vertical feed to avoid lateral force causing edge collapse.Use water or special coolant to cool down in time (resin grinding wheels should avoid water and need dry cutting).Maintenance points:Regularly use cleaning stones or alumina blocks to "sharpen the blade" to remove blocked debris.Store moisture-proof and collision-proof, and resin grinding wheels should be protected from light to prevent aging.VI. Common problems and solutionsExcessive wear: It may be caused by too hard a bond or too soft a material → Replace a soft bond grinding wheel.Cutting speed decreases: blockage or abrasive passivation → clean or trim the grinding wheel surface.Cut edge collapse: too coarse grain or too fast feed → change to fine grain/reduce feed speed.VII. Application scenariosConstruction industry: concrete wall sawing, stone carving.Manufacturing industry: carbide tool sharpening, ceramic component finishing.Electronic industry: silicon wafer, sapphire substrate cutting.Jewelry processing: precise cutting of diamonds and jade.Through reasonable selection and standardized operation, diamond cutting wheels can significantly improve processing efficiency and quality, becoming the core tool for hard material processing.Diamond grinding segment, diamond grinding wheels, Diamond Grinding pad, diamond grinding disc1. Abrasive size: 350mm-3500mm2. Application: For cutting granite & marble3. With two PCD and one segmet1. Fast cutting2. High efficency3. Fast cutting granite & marble4. Segments shape: Straight, rapered or sandwich5. Available size: 350mm-3500mmDiamond segment, from 300mm to 3500mm, is appliable for cutting normal, soft hard Marble and Granite, Andesite, sandstone, limestone and etc and good quality for gangsaw.
Purchasing Agent
Note: Send your message to supplier or manufacturer.
Welcome to our Professional and comprehensive procurement services...
Message:
OK ! We suggest you detail your product requirements and company information here.
Enter between 20 to 4,000 characters.
Your inquiry content must be between 20 to 4000 characters.