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4 Inches Semi-Automatic Wafer Grinder Dag8101
Grinder, 4 Inches Wafer Grinder, Precision Thickness Grinding
Ninghai County Chalu Jinbaili Daily Necessities Store
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Product Description Semi- automatic wafer grinder 5140 HG5140 wafer grinder is a semi-automatic thinning machine with single grind spindle and single chuck, manual wafer loading/un loading, The machine is compatible with the thinning of 4/8inch wafers and features in compact design, small footprint, high reliability, can support multiple wafers thinning at the same time, is suitable for processing resin material substrate and SiC, etcFeatures15 inches high sensitivity LCD screen, user friendly GUI High power, high rigidity spindle, low vibration, rotation speed range 1000-6000rpm High precision thickness guage, measuring range of 0-2.4mm, with resolution 0.1um, Repeatability: ±0.5um IPC bus control mode, faster response time, more scalable ability Min wafer thickness grind to 100um, back side TTV≤3um after grinding, Surface roughness Ra≤0.02um (#2000 grinding wheel) Configuration: Work piece size(inch)4/5/6/8Z Axis Stroke(mm)120In-feed speed (mm/s)0.0001-0.080Min index resolution(mm)0.1 Utilities Power(kVA)13KVA(three phase,380V) Air pressure(MPa L/min)0.5~0.8Max consumption≥150 Wheel coolant(MPa L/min)0.3~0.4Max consumption≥20 Spindle coolant(MPa L/min)0.3~0.4Max consumption≥3.0 Duct(m3/min) ≥4.0 Foot print W*D*H(mm) 700*1890*1750 Weight(kg) 1500
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