99.95% Metal Niv7 Rotary Tube Nickel Vanadium Alloy Target Material with Polished Surface¹

Product Description Product Description XinKang Top Ranking  Competitive Price Customized Polished Surface 99.95% High Purity NiV7 Nickel Vanadium Alloy Target for PVD ProcessNameMetal Nickel Vanadium Alloy Sputtering Targets Purity99.9%-99.99%SizeD50.8x3mm, D76.2x6mm,2inch,3inch, As requestNi Boiling Point2732Ni Density8.9g/cm3Ni Melting Point1453.0ShapePlanar target, Rotary target.MOQ1PCSApplicationEvaporation materials, PVD Film Coating and etcPreparation process of nickel-vanadium alloy sputtering target Material Preparation - Vacuum Induction Melting - Chemical Analysis - Forging - Rolling - Annealing - Metallographic Inspection - Machining - Dimensional Inspection - Cleaning - Final Inspection - Packaging In the fabrication of integrated circuits, pure gold is generally used as interconnect metal, deposited on a silicon wafer, but gold will diffuse into the silicon wafer to form a high-resistance AuSi compound, which will greatly reduce the current density in the wiring, resulting in the failure of entire wiring system. So, It is proposed to add adhesive layer between the gold thin film and silicon wafers. The adhesive layer is usually made of pure nickel, but diffusion also occurs between the nickel layer and the gold conductive layer, so that a barrier layer is needed to prevent diffusion between the gold conductive layer and nickel adhesive layer. With a high melting point and a large current density, vanadium is chosen to deposit barrier layer, therefore, nickel sputtering target, vanadium sputtering target, gold sputtering target are all used in the fabrication of integrated circuits.Nickel vanadium NiV sputtering targets containing 7% vanadium has both advantages of nickel and vanadium, thus adhesive layer and barrier layer can be achieved at a time. NiV alloy is non-magnetic materials, which is conducive to magnetron sputtering. In the electronics information industry, it is gradually replacing pure nickel sputtering targets.The picture below are two micrographs of our NiV(93/7 wt%) alloy sputtering target, the average grain size<100μm.Following is a typically Certificate of analysis for 3N5 NiV 97/3wt% sputtering target.      Application: Other Related Sputtering TargetsMetal Target Ni,Al,Cu,V,Co,W,Mo,Ta,Nb,Cr,Ti,Zr,Hf,Mg,Fe,Zn,Pb,Sn,Bi,Ga,Ge,In,Si,C,B,Te and rare earth targetsAlloy TargetNi,Fe,Co,Cu,Al alloy. and special alloy Evaporation MaterialsNi,Al,Cu,V,Co,W,Mo,Ta,Nb,Cr,Ti,Zr,Hf,Mg,Fe,Zn,Pb,Sn,Bi,Ga,Ge,In,Si,C,B,Te and etcCeramic TargetsOxide Ceramic, Compound ceramic targets.     Company Information FAQ 1. Are you trading company or manufacturer ?Xinkang: We are a professional manufacturer specialized in this field for over 10 years. 2: How long is your delivery time?Xinkang: Shipment can be made in 5-7 days for those regular size, or samples , and 15-20 days for batch quantity.  3: Do you have MOQ ? Xinkang: No, we support samples. 4: What is your payment method?Xinkang: T/T in advance, Paypal , Western Union and etc.  

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