IPDB › China Industry › Tools & Hardware › Abrasive & Grinding
Silicon Grinding Wheels/Silicon Wafer Back Grinding Wheels1
Abrasive Grinding, Sharpening Stone, Silicon Wafer Grinding Wheel, Diamond Wheel
Zhengzhou Hongtuo Precision Tools Co., Ltd.
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Product Description grinding wheelHongtuo can provide a full range of CBN and diamond honing stones, honing tools, CBN and diamond grinding wheels, diamond dicingblades,diamond rotary dressers and other super abrasives tools. These products are widely used in automotives, motorcycles,aerospace, refrigerator compressor, sewing machine components, hydraulics, bearings, semiconductors, solar energy and otherindustries. Silicon Wafer Back Grinding WheelsApplication areas and scope of application:It is mainly used for thinning and fine grinding of semiconductor wafersFeatures:1. Excellent grinding performance and high cost performance.2. lt can be stably used in grinding machines made in Europe, America, Japan and China, and can replace imported products.Product nameSilicon Wafer Back grinding wheelOEMSupportedAdvantageGood performanceSizeCustomizedBondCBN&DiamondGrit sizeCustomizedOEDSupportedPackageWoonden box & cartoon box
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