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Sputter/Sputtering Target Mono Crystal Silicon for Sputtering Machine1
Target MaterialSilicon Sputtering TargetSi Sputter Target
Changsha Xinkang Advanced Materials Co., Ltd.
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Product Description Thin film coating materials silicon/Si sputtering target Silicon/Si Sputtering TargetSilicon sputtering target, as a very important functional materials, it mainly used for depositing SiO2, Si3N4 and other deelectric layer by magnetic sputtering process. Those thin films are characterized by excellent hardness, optic, dielectric properties, wear and corrosion resistance, which are widely applied to the field of LCD transparent conducting glass, LOW-E building glass and micro-electronics.FeaturesType: poly-crystalline or mono-crystallinePurity: 5N, 6NAvailable shape: Planar, RotaryGrowth method: Czochralski (CZ)Density:2.33g/cm3Conductivity type: P type (Boron doped) & N type (phosphorus doped)Dimension:length:300mm maxwidth:150mm maxdiameter:300mm maxthickness:3-12mmtolerance:±0.1mmSpecific resistance:0.005-0.02 ohm.cm 1-10 ohm.cm 10 ohm.cm min Planeness (TIR): < 1.2μmPartial planeness (STIR): <0.3μmWarp: <30μm
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