IPDB › China Industry › Tools & Hardware › Abrasive & Grinding
Outer Diameter 350mm Silicon Back Grinding Wheels for Wafer Thinning1
Abrasive Grinding, Sharpening Stone, Silicon Wafer Grinding Wheel, Diamond Wheel
Zhengzhou Hongtuo Precision Tools Co., Ltd.
Preview:
Product Description Silicon Wafer Back Grinding Wheels Application areas and scope of application:It is mainly used for thinning and fine grinding of semiconductor wafersFeatures:1. Excellent grinding performance and high cost performance.2. lt can be stably used in grinding machines made in Europe, America, Japan and China, and can replace imported products.Product nameSilicon Wafer Back grinding wheelOEMSupportedAdvantageGood performanceSizeCustomizedBondDiamondGrit sizeCustomizedOEDSupportedPackageWoonden box & cartoon box
Purchasing Agent
Note: Send your message to supplier or manufacturer.
Welcome to our Professional and comprehensive procurement services...
Message:
OK ! We suggest you detail your product requirements and company information here.
Enter between 20 to 4,000 characters.
Your inquiry content must be between 20 to 4000 characters.