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SIM Card Chip Reel Glue-Tape Lamination Machine1
Smart Card Making Machine, GSM Chip Hot Melt Glue Tape Lamination, Chip Reel Acf Glue Lamination
Guangzhou Mingsen Technologies Co., Ltd.
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Product Description Feature:This machine is PLC controlled and it is convenient to operate with easy optional English/Chinese touch screen operation interface.Glue punching and lamination enjoys high accuracy.Changing between 6 pin and 8 pin glue lamination is convenient.Stations:1IC, glue release: to release IC tape and glue tape.2Glue die-cut: to cut square or round hole for 6 or 8 pin chip.3Glue-tape lamination: to heat and laminate glue tape at the back side of 6 or 8 pin chip.4IC tape leading unit: to drive IC tape.5IC tape collecting: to collect laminated IC tape. Technical parametersSpeed10,000chips/hTotal power1.5KWPower supply~220V 50/60HzAmbient temperature0-40oCAir supply0.6-0.8MPaHumidity15~90%Machine out-line dimension1700×550×1600mm << MINGSEN MANUFACTURES A TO Z SMART CARD PRODUCTION LINE >> << CERTIFICATE >><< EXHIBITION >>
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