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Diamond Dicing Blade for Semiconductor Industry1
Diamond ToolsDicing BladeQuartz Dicing Blade
Zhengzhou Hongtuo Precision Tools Co., Ltd.
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Product Description Metal Bond QS-RM Series Dicing BladesQS-RM series of cutting blade selection of imported diamond powder and metal sintering. This series of blade has strongcontrolling ability and high wear resistance, it is suitable for precision cutting and slotting machining of electronic componentsand optical components.Applications:Optical glass, ceramics, ferrite, quartz, packaging material, etc.Features1. Strong diamond holding ability of metal bond.2. High wear resistance.3. Long service life, good shape, can inhibit the obliquecutting & the occurrence of serpentine shape cutting.Product NameDicing bladesFeaturesLong life & High wear resistance.AbrasiveDiamondApplicationsGlass, ceramics, ferrite, quartz etcBond TypeMetal & ResinSampleAvailableSizeCustomizedGrit size400-5000#
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