IPDB › China Industry › Manufacturing & Processing Machinery › Stone Processing Machinery
Inner Diameter Cutting Machine for Semiconductor1
Stone Processing Machinery, ID Slicer, ID Cutter
Guangzhou Minder-Hightech co.,Ltd
Preview:
Product Description INNER CIRCLE SLICERDetails Inner circle fully automatic slicing machine is using inside circle to cut a variety of semiconductors, crystal, ceramic, NdFeB magnetic material. Installed in the spindle, the edge-type Diamond blade cutter is high-speed rotating, the table was feeding by computer control of horizontal and vertical movement, the material on the fixture of the table was cut into the required product. We have the semi-automatic/fully automatic inner circle clicking machine, within a circle slicer two kinds of specifications, a variety of models. For the Automatic Slicer inner circle. a worker can operate about 16 units slicer at the same time.MD-IDC9580Main technical parameters:Max machining size(mm):φ95 ×80 mmCutting speed (cm2/mm):3-6(cm2/mm)Degree of balance sheets by cutting deviation(mm):±0.005mmCutting film thickness(mm):≥0.30The thin-cut tolerance(mm):±0.005mmHorizontal stroke(mm):120mmLongitudinal travel(mm):110mmSpindle Electrical:3 Phase 0.75kwSpindle Speed (r/min):2800Rev / minAdjust the amount of work clamp:Horizontal angle:±45oPitch angle of elevation:±10oVertically(mm):20Cooling tank capacity(kg):50kg Cooling tank motor: 3 Phase 0.12kw 2780r/minPower:Three-phase four-wire 50Hz 380VDimensions(mm):1130 ×850 ×1500Weight(kg):~1400(kg)Contact:Guangzhou Minder-hightech Co.,ltdNo.1 Xingya 3rd road, Panyu district, Guangzhou, Ghinacontact: Shunyu Hu www.minder-hightech.con
Purchasing Agent
Note: Send your message to supplier or manufacturer.
Welcome to our Professional and comprehensive procurement services...
Message:
OK ! We suggest you detail your product requirements and company information here.
Enter between 20 to 4,000 characters.
Your inquiry content must be between 20 to 4000 characters.