IPDB › China Industry › Manufacturing & Processing Machinery › Stone Processing Machinery
Semiconductor Device Fabrication Fab Wafer Fabrication Feol Substrate CMP Cyctem for Lapping1
Stone Processing Machinery, Lapping Machine, Polishing Machine
Guangzhou Minder-Hightech co.,Ltd
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Product Description MDS8104LMFR/MDS8104PMFRSEMIAUTO SUBSTRATE LAPPING/POLISHING MACHINEMachine Application Process Type Sort by Process Material Sort by ApplicationSINGLE SIDEPLATE LAPPING &POLISHINGMetal & AlloyCeramicOxideCarbideGlassPlasticSemi ConductorLED substrate Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, InP, ZnO, AlN, Al2O3, etc.ResinPE,E/VAC,SBS,SBR,NBR,SR,BR,PRPCB,, adhensive,coating,circuitOptical ,,,HUDoptical lens,HUD glass, screen glassRadarGemstaoneOthersOxide coating plateJade,sapphire,agate etcValve sealing ring. Micrometer Diamond,bearing,etcLapping can only remove slight thickness of object.if thining margin>=100um, thinner machine are needed.(contact us for thinner)Machine SpecificationMachine Class Standard SpecificationMachine SeriesMDS8104LMFRPlate diameterΦ810mmMax. Object DiameterΦ350 mmNumber of station4Plate Rotate Speed0-90 RPMCylinder Bar Rotate Speed0-40 RPMFacing & Grooving SpeedNot include in Polishing0-120mm/mTotal weight2200kgFloor space2200*1200mm Optional ChoiceSpecificationControlsDigital / Touch-screen PLCPressure SourceIntegrated with PLCFacing & Grooving systemDigital / Manual control feeding depth integrated with PLC / PLC control feeding depth integrated with PLCPlate cooling systemIntegrated in MachineSlurry supply systemDigital / integrated with PLCCylinder Bar Drive SystemIntegrated with PLCDust Vacuum systemManual / Integrated with PLC1,Sample making based on production requirement can confirm the necessity of optional kits.2,The shaded options is buit in this machine.3,Facing and Grooving system is unnecessary for polishing machine and not configured.4,Substrate Lapping/Polishing machine is highly configured, A dust-proof shelter is utilized for protection from fugitive or solid particle scraping against object's surface while processing, especially when polishing.5,Contact us for more type of lapping/polishing machine SamplesSample RecordApplication & Material MDS8104LMFR/MDS8104PMFRSEMIAUTO SUBSTRATE LAPPING/POLISHING MACHINEMachine ApplicationProcess TypeSort by Process Material Sort by ApplicationSINGLE SIDEPLATE LAPPING &POLISHINGMetal & AlloyCeramicOxideCarbideGlassPlasticSemi ConductorLED substrate Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, InP, ZnO, AlN, Al2O3, etc.ResinPE,E/VAC,SBS,SBR,NBR,SR,BR,PRPCB,, adhensive,coating,circuitOptical ,,HUDoptical lens,HUD glass, screen glassRadarGemstaoneOthersOxide coating plateJade,sapphire,agate etcValve sealing ring. Micrometer Diamond,bearing,etcLapping can only remove slight thickness of object.if thining margin>=100um, thinner machine are needed.(contact us for thinner)Machine SpecificationMachine Class ()Flat LappingMachine()Double DiscLapping MachineBrush PolishingMachineSubstrate Grinding/Thinning Machine Standard SpecificationMachine SeriesMDS8104LMFRPlate diameterΦ810mmMax. Object DiameterΦ350 mmNumber of station4Plate Rotate Speed0-90 RPMCylinder Bar Rotate Speed0-40 RPMFacing & Grooving SpeedNot include in Polishing0-120mm/mTotal weight2200kgFloor space2200*1200mm Optional ChoiceSpecificationControlsDigital / Touch-screen PLCPressure SourceIntegrated with PLCFacing & Grooving systemDigital / Manual control feeding depth integrated with PLC / PLC control feeding depth integrated with PLCPlate cooling systemIntegrated in MachineSlurry supply systemDigital / integrated with PLCCylinder Bar Drive SystemIntegrated with PLCDust Vacuum systemManual / Integrated with PLC1,Sample making based on production requirement can confirm the necessity of optional kits.2,The shaded options is buit in this machine.3,Facing and Grooving system is unnecessary for polishing machine and not configured.4,Substrate Lapping/Polishing machine is highly configured, A dust-proof shelter is utilized for protection from fugitive or solid particle scraping against object's surface while processing, especially when polishing.5,Contact us for more type of lapping/polishing machine SamplesSample RecordApplication & MaterialDiagonal DiameterProcessType FlatnessRoughnessParallelThicknessNote Industrial Sapphire variousLappingPolishing2μm≤Ra 0.02 μm5μm±1μm0.2mmN Solar WaferVariousLapping1μmNot Required2μm±1μm0.15mmN SubstrateCaC2Φ22mmLapping0.5μmNot Required1μm±0.5μm0.05mmN WaferSiVariousLappingPolishing2μm≤Ra 0.02 μm3μm±1μm0.1mmN LED substrate copperΦ169mmLappingPolishing 5μm≤Ra 0.01 μm5μm±1μmNot required N SubstrateMgO Φ72mmLapping1μmNot Required1μm0.1mmN SubstrateAl2O3Φ158mmLappingPolishing3um≤Ra 0.02 μm3um±1μm0.13mmN onal DiameterProcessType FlatnessRoughnessParallelThicknessNote Industrial Sapphire variousLappingPolishing2μm≤Ra 0.02 μm5μm±1μm0.2mmN Solar WaferVariousLapping1μmNot Required2μm±1μm0.15mmN SubstrateCaC2Φ22mmLapping0.5μmNot Required1μm±0.5μm0.05mmN WaferSiVariousLappingPolishing2μm≤Ra 0.02 μm3μm±1μm0.1mmN LED substrate copperΦ169mmLappingPolishing 5μm≤Ra 0.01 μm5μm±1μmNot required N SubstrateMgO Φ72mmLapping1μmNot Required1μm0.1mmN SubstrateAl2O3Φ158mmLappingPolishing3um≤Ra 0.02 μm3um±1μm0.13mmN
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