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Double Sided Grinding Ball Throwing Machine1
Stone Processing Machinery, Grinding Ball Machine, Double Sided Grinding Machine
Shanghai Anttrans Technology Co., Ltd
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Product Description Equipment IntroductionThis machine is primarily used for the double-sided high-precision grinding or polishing of silicon wafers, gallium arsenide wafers, ceramic wafers, quartz crystals, and other semiconductor materials. It is also suitable for the double -sided high-precision grinding or polishing of other hard, brittle, and thin materials such as metals, nonmetals, optical glass, and sapphire.Equipment FeaturesThe machine body structure is optimally designed, and the frame adopts a gantry structure, which provides good rigidity and strong pressure-bearing capacity, enabling stable high-speed operation under high loads.The lower disc, upper disc, and sun gear are driven separately by motors. The motors are all frequency conversion motors controlled by frequency converters, allowing them to operate at any speed within the effective setting range and achieve smooth stopping, acceleration, deceleration, and reversal, effectively preventing the breakage of thin and brittle workpieces.The planetary gear transmission adopts a pin tooth structure for smooth and impact-free transmission, resulting in a long service life for the planetary gear. The pin tooth adopts a pin sleeve structure made of stainless steel material that is hardened through heat treatment, which is rust-proof and wear-resistant. After the pin tooth wears out, only the pin sleeve needs to be replaced, making it convenient and simple with low usage costs.During the descent of the upper disc, fast descent and slow descent are set. The slow descent stroke is adjustable within the cylinder stroke range, and the slow descent speed can also be freely adjusted according to the impact resistance of the workpiece.This machine adjusts and controls the processing pressure through a precision electrical proportional valve. The processing pressure can be set according to different processing requirements, with high pressure control accuracy.It adopts an advanced PLC system and a touchscreen operation panel. All process parameters and recipes can be modified and set on the touchscreen, and the entire processing process can be automatically completed according to the preset process parameters.The gears and moving parts adopt a centralized lubrication device for good lubrication and a long service life of the entire machine.A safety device is designed for the lifting of the upper disc, which can effectively prevent the upper disc from suddenly falling when it rises to the top.Equipment ApplicationsOptics Industry: In the processing of optical elements such as lenses and prisms, the double-sided grinding and polishing machine can ensure that the optical elements achieve extremely high flatness and smoothness, meeting the strict surface quality requirements and thus enhancing optical performance.Glass and Quartz: The double-sided grinding and polishing machine is also widely used in the grinding of hard and brittle materials such as glass and quartz, ensuring high-precision processing of these materials.Semiconductors: In the processing of semiconductor materials, the double-sided grinding and polishing machine can provide micron-level or even nanometer-level accuracy requirements, suitable for the surface treatment of electronic components such as precision ceramics and wafers.Electronic and Electrical Industry: In the electronic and electrical industry, the double-sided grinding and polishing machine is used to process various electronic components and circuit boards, ensuring their stability and reliability during assembly and use, among other fields.Equipment ParametersItemParameterItemParameterUpper Grinding Disc SizeΦ610×φ210×40(mm)Upper Disc Motor4.0KwLower Grinding Disc SizeΦ610×φ210×40(mm)Auxiliary Motor1.5KwPlanetary Gear ParametersOuter Diameter 23 4mm, Metric Modulus: 2, Number of Teeth: 115Total Equipment Power9.5KwNumber of Planetary Gears5Dimensions1200×1200×2400(mm)Maximum Work piece SizeΦ200(mm)Equipment Weight≈2000KgWork piece Thickness0.3-30(mm)Planar Processing AccuracyRMS 0.135umLower Grinding Disc Speed0-50(rpm)Thickness Tolerance AccuracyNot Exceeding ±0.03mmMaximum Processing Pressure200KgSurface RoughnessR z0.05Main Cylinder100×350Work piece ParallelismError of 1 Arc SecondMain Motor4.0KwSurface Cleanliness11141 -84 Grade 3Processing CycleSet grinding and polishing cycle time and machine shutdown after processing cycle completionDetailed Photos
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